Don Kurelich | Technical DIrector of American Sales | Mentor Graphics
Don Kurelich is the Technical Director of Americas Sales managing the field application engineers throughout North and South America responsible for the sales and support across all systems, semiconductor, and transportation products. Mr. Kurelich also manages executive relationships and product deployment for key accounts worldwide. He has over 20 years of design, management, consulting and sales experience with 5 years of international business/management experience while living abroad. Prior to joining Mentor Graphics in 1996, Mr. Kurelich worked in the telecommunications industry at NEC and Bosch Telecom and in the Military/Aerospace industry at Honeywell in their ASIC design and wafer fabrication facility in various ASIC and systems design roles. He holds a BSEE from George Mason University.
Paul D. Franzon | Professor | North Carolina State University
Paul D. Franzon is currently a Distinguished Alumni Professor of Electrical and Computer Engineering at North Carolina State University. He earned his Ph.D. from the University of Adelaide, Adelaide, Australia in 1988. He has also worked at AT&T Bell Laboratories, DSTO Australia, Australia Telecom and two companies he cofounded, Communica and LightSpin Technologies. His current interests center on the technology and design of complex microsystems incorporating VLSI, MEMS, advanced packaging and nano-electronics. He has lead several major efforts and published over 200 papers in these areas. In 1993 he received an NSF Young Investigators Award, in 2001 was selected to join the NCSU Academy of Outstanding Teachers, in 2003, selected as a Distinguished Alumni Professor, and received the Alcoa Research Award in 2005. He is a Fellow of the IEEE.
Ruben Fuentes | Sr. Director - Package Design Center | Amkor Technology
Ruben Fuentes is a Sr. Director in the Technology and Platform Development group at Amkor Technology. Ruben is responsible for Amkor's package design operations in the United States and has been working in the electronic packaging industry since 1995. With over 17 years of experience, Ruben has gained an extensive knowledge of the semiconductor packaging industry and has expertise in the design, assembly, and manufacturing processes of advanced semiconductor packages. Ruben has also played an instrumental role in the development of package design software and automation for existing and next-generation products.
Riko Radojcic | Director of Engineer | Qualcomm
Riko Radojcic is a Director of Engineering at Qualcomm CDMA Technologies, and a leader of various Design-for-Technology initiatives; including Design for 3D Integration, design for Manufacturability & Variability, Si-package CoDesign, etc.. and involving methodologies at polygon, circuit, logic, and/or system design levels.
Radojcic has more than twenty-five year's experience in the semiconductor industry, specializing in the integration of process, design and EDA considerations, and design-for-Si solutions. Before joining Qualcomm, he was a consultant to semiconductor and EDA companies providing engineering and business development services focused on process-design integration. He was a director of business development and marketing for DFM solutions at PDF Solutions and was a business manager and an architect with Tality and Cadence, specializing in design technology integration and process characterization and modeling.
Radojcic has held a series of managerial and engineering positions with Unisys and Burroughs, in device engineering, failure analyses and reliability engineering areas. He began his career as a process engineer with Ferranti Electronics, UK.
Radojcic received his BSc and PhD degrees from University of Salford, UK.
Matthew Hogan | Calibre Technical Engineer | Mentor Graphics