Secure Silicon – the Root of Trust
Presented by Walden C. Rhines, President and Chief Executive Officer of Mentor, a Siemens business
Security threats are growing exponentially–from viruses in application software, and malware in the operating system to small malicious modifications in the underlying silicon. Growth of the Internet of Things and Cloud Computing magnifies the impact of the security problem by orders of magnitude.
Since hardware is the root of trust in an electronic product, EDA companies will be increasingly pressured to solve the silicon security problems for their customers. This requires a new paradigm in silicon design creation and verification. Join Wally Rhines, CEO of Mentor, a Siemens business, as he examines the growing threats to silicon security and EDA’s possible solutions.
Walden C. Rhines Bio
WALDEN C. RHINES
is President and Chief Executive Officer of Mentor, a Siemens business. He was previously CEO of Mentor Graphics for 23 years and Chairman of the Board for 17 years. During his tenure at Mentor, revenue nearly quadrupled and market value of the company increased 10X.
Prior to joining Mentor Graphics, Dr. Rhines was Executive Vice President of Texas Instruments’ Semiconductor Group. During his 21 years at TI, he was President of the Data Systems Group and held numerous other semiconductor executive management positions.
Dr. Rhines has served on the boards of Cirrus Logic, QORVO, TriQuint Semiconductor, Global Logic and as Chairman of the Electronic Design Automation Consortium (five two-year terms) and is currently a director. He is also a board member of the Semiconductor Research Corporation and First Growth Children & Family Charities. He is a Lifetime Fellow of the IEEE and has served on the Board of Trustees of Lewis and Clark College, the National Advisory Board of the University of Michigan and Industrial Committees advising Stanford University and the University of Florida.
Dr. Rhines holds a Bachelor of Science degree in engineering from the University of Michigan, a Master of Science and PhD in materials science and engineering from Stanford University, a master of Business Administration from Southern Methodist University and Honorary Doctor of Technology degrees from the University of Florida and Nottingham Trent University.
Presented by Venugopal Puvvada, Vice President – Enginering, Qualcomm BDC
Venugopal Puvvada Bio
Venugopal Puvvada has been Vice-President, Engineering at Qualcomm Bangalore Design Center, for the past eleven years. Currently he is responsible for Central Engineering and Technology Team. At Qualcomm Venu was responsible for more than 50 tapeouts and has driven SoC execution, CAD/Methodology, Library Development, Chip cost reduction, Machine Learning, Power Optimization and High Performance cores. Before joining Qualcomm, Venu worked at TI India for 13 years and was a Senior Member Technical Staff. He has 3 patents accepted, 2 more filed and several technical publications to his credit. Venu has been on Low Power Panels at DAC and VLSI Design Conferences. Venu has done M.S (Micro-electronics) in 1993 and B.Tech in 1991 from I.I.T. Madras.