Semiconductor Specialization Drives New Industry Structure
Walden C. Rhines, President and Chief Executive Officer of Mentor, a Siemens Business
Unlike industries that mature and consolidate as their growth rates slow, the semiconductor industry is following a new path. Through a series of consolidations and divestitures, major semiconductor companies are focusing their businesses on markets where they can be the dominant suppliers. This has led to unprecedented profitability for the most specialized semiconductor companies and has created fertile ground for new startups, which are rapidly increasing in number during recent quarters. Dr. Rhines will analyze the changing industry dynamics and provide suggestions for the continued success of the semiconductor industry.
Walden C. Rhines Bio
WALDEN C. RHINES
is President and Chief Executive Officer of Mentor, a Siemens business. He was previously CEO of Mentor Graphics for 23 years and Chairman of the Board for 17 years. During his tenure at Mentor, revenue nearly quadrupled and market value of the company increased 10X.
Prior to joining Mentor Graphics, Dr. Rhines was Executive Vice President of Texas Instruments’ Semiconductor Group. During his 21 years at TI, he was President of the Data Systems Group and held numerous other semiconductor executive management positions.
Dr. Rhines has served on the boards of Cirrus Logic, QORVO, TriQuint Semiconductor, Global Logic and as Chairman of the Electronic Design Automation Consortium (five two-year terms) and is currently a director. He is also a board member of the Semiconductor Research Corporation and First Growth Children & Family Charities. He is a Lifetime Fellow of the IEEE and has served on the Board of Trustees of Lewis and Clark College, the National Advisory Board of the University of Michigan and Industrial Committees advising Stanford University and the University of Florida.
Dr. Rhines holds a Bachelor of Science degree in engineering from the University of Michigan, a Master of Science and PhD in materials science and engineering from Stanford University, a master of Business Administration from Southern Methodist University and Honorary Doctor of Technology degrees from the University of Florida and Nottingham Trent University.
Hooman Moshar, Vice President of Engineering, Broadcom Corporation
Over the course of past decade many factors have been influential in recognition of the fact that power consumption is rapidly becoming the overriding limitation in developing cost effective products. This talk will give a high level overview of why power is a major obstacle, review the power issues surrounding development of cost sensitive consumer electronic products in bulk CMOS, and touch upon approaches taken to battle power.
Hooman Moshar Bio
currently serves as Vice President of Engineering responsible for the VLSI operations of the Broadband Carrier Access Business Unit of Broadcom Corporation. Over the course of last 20 years he has managed the development of several products including DOCSIS Cable Modems and Headend CMTS, DSL CPE, PON CPE, and WiFi Access Point products. In addition he has been responsible for the development and integration of embedded CPU, USB, PCIe, HDMI, MOCA, DDR Memory Controllers, Network Accelerators, Ethernet MACs and Switches, WAN/LAN SERDES, and Audio Processor Module IP’s that are used in Broadcom products.
Mr. Moshar began his career at Xerox Corporation in 1981, designing and managing the development of ASICs for network publishing products. In 1994, he joined Rockwell Communication Systems to develop chip sets for PC-based audio, fax engine controllers and digital cordless phones. Since 1997, he has been a leader at Broadcom working to expand the cable modem design group and manage the residential broadband activities at Broadcom’s Irvine, California location.