“Semiconductor Consolidation versus Specialization”
The Keynote will be presented by Walden C. Rhines, Chief Executive Officer and Chairman of the Board of Directors, Mentor Graphics Corporation.
Mega-mergers that have been announced in the semiconductor industry over the last two years have prompted many to predict that the semiconductor industry is consolidating down to a handful of companies, just the way consolidation has historically occurred in industries like steel, mining, and pharmaceuticals. Traditional industries are driven to consolidate at maturity so that they can continue to generate cash and increase profitability despite very slow revenue growth. The semiconductor industry is fundamentally different. Dr. Rhines will analyze some of the differences and present a projection that refutes many common beliefs about our industry. He will show that the semiconductor industry is specializing, rather than consolidating, and will highlight some of the differences from traditional industries, including the ongoing and future reduction of semiconductor unit costs.
Walden C. Rhines Bio
WALDEN C. RHINES
is President and Chief Executive Officer of Mentor, a Siemens business. He was previously CEO of Mentor Graphics for 23 years and Chairman of the Board for 17 years. During his tenure at Mentor, revenue nearly quadrupled and market value of the company increased 10X.
Prior to joining Mentor Graphics, Dr. Rhines was Executive Vice President of Texas Instruments’ Semiconductor Group. During his 21 years at TI, he was President of the Data Systems Group and held numerous other semiconductor executive management positions.
Dr. Rhines has served on the boards of Cirrus Logic, QORVO, TriQuint Semiconductor, Global Logic and as Chairman of the Electronic Design Automation Consortium (five two-year terms) and is currently a director. He is also a board member of the Semiconductor Research Corporation and First Growth Children & Family Charities. He is a Lifetime Fellow of the IEEE and has served on the Board of Trustees of Lewis and Clark College, the National Advisory Board of the University of Michigan and Industrial Committees advising Stanford University and the University of Florida.
Dr. Rhines holds a Bachelor of Science degree in engineering from the University of Michigan, a Master of Science and PhD in materials science and engineering from Stanford University, a master of Business Administration from Southern Methodist University and Honorary Doctor of Technology degrees from the University of Florida and Nottingham Trent University.
Keynote PCB Tracks:
“Transformative PCB Systems Development within the Product Lifecycle”
The Keynote will be presented by Paul Musto, Marketing Director, Mentor, A Siemens Business.
For too long, printed circuit board (PCB) development has been limited to incremental improvements around design cycle-times, cost-control initiatives, and quality improvement drivers. Transformative product development enables the creation of real business opportunities throughout the product development lifecycle, from concept creation to after-market servicing. This session will review Mentor’s initiatives to deliver transformative PCB systems development through greater integration of the mechanical and electrical domains: ECAD-MCAD co-design; 3D physical layout and simulation; reliability analysis; integrated requirements for capture and tracking; and the incorporation of manufacturability feedback into design. This session will also cover includes the methodologies of integrating native PCB systems data into Siemens Teamcenter, and the resulting in opportunities this presents in for driving organizational smart innovation initiatives.
Paul Musto Bio
Keynote DFT Track:
“A New Generation of Automotive Semiconductor Test Solutions”
The Keynote will be presented by Steve Pateras, Tessent Marketing Director, Mentor, A Siemens Business.
The amount of electronic content in passenger cars continues to grow rapidly, driven largely by the integration of various ADAS and autonomous driving capabilities. It is of course critical that these devices adhere to the highest possible quality and reliability requirements. Meeting the functional safety requirements mandated by the ISO 26262 standard requires the integration of advanced self-test and monitoring capabilities throughout the vehicle’s electronics. The capabilities must not only have the ability to fully test all electronics during power-up, but more importantly must provide the ability to perform periodic tests throughout the functional operation of the vehicle. These requirements result in many challenges including meeting necessary fault coverage metrics, maintaining periodic testing without adversely affecting the performance of the vehicle and achieving a system-wide test strategy that is compatible with a wide range of system architectures. The Mentor Tessent product family offers a new generation of test solutions to address these evolving challenges.
Steve Pateras Bio
Keynote Functional Verification Tracks:
“Innovations in IoT, Automotive, and Networking: Driving the Next Big Wave in Verification”
The Keynote will be presented by Dr. Ravi Subramanian, Vice President and General Manager, IC Verification Solutions Division, Mentor, A Siemens Business.
Our industry has experienced remarkable breakthroughs in automotive, networking, and communication technology in recent years. Yet, it is the convergence of these technologies that is driving the next big thing in innovation related to IoT and autonomous systems. In addition, it is also driving the need for new approaches to verify today’s complex systems. In this keynote, Dr. Ravi Subramanian shares a holistic view of the next big wave in verification.
Ravi Subramanian Bio